This review compares the mechanical and thermal-electrical properties of sintered copper
(Cu) with sintered silver (Ag) as bonding materials in the microelectronics joint applications …

Semiconductor power modules are core components of power electronics in electrified
vehicles. Packaging technology often has a critical impact on module performance and …

There has been a significant rise in the number of research papers on silver nanoparticle
based solutions for harsh environment die attach. However, sintering nanoparticles is a …

This work firstly evaluated the microscale mechanical properties of sintered Ag, consisting of
various Ag particles of a flake shape and spherical shape from nano to micro size …

Sintered Ag joint is a potential Pb-free die attach materials for power electronics because of
its high operating temperature, high electrical and thermal conductivity as well as its thermo …

The process of sintering involves applying pressure and heat to the materials without
melting them in order to fuse the particles together into a solid mass. The fusion between the …

Light-emitting diodes (LEDs) are considered an ideal substitute for low-efficiency traditional
light sources with broad applications in all scientific disciplines. For the past recent years …

Ag sinter joining technology has been used in the advanced power applications to replace
conventional soldering technology due to its high temperature stability, along with its …

Robust bonding of Cu quasi-nanoparticles sintering for Ag coated chip and bare copper
substrate was achieved. The effect of temperature, pressure and time on the sintering …

Robust bonding and thermal-stable sinter Ag joining on an Au finished substrate was first
time achieved for use in SiC power modules. Five kinds of Ag paste, including different …