DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C [C@@ H]
1CC [C@@] 2 (CC [C@@] 3 (C (= CC [C@ H] 4 [C@] 3 (CC [C@@ H] 5 [C@@] 4 (CC …

H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid
state devices; Multistep manufacturing processes thereof the devices being of types …

G11C11/401—Digital stores characterised by the use of particular electric or magnetic
storage elements; Storage elements therefor using electric elements using semiconductor …

A chip package used as a logic drive, includes: multiple semiconductor chips, a polymer
layer horizontally between the semiconductor chips; multiple metal layers over the …

(57) ABSTRACT A multi-chip package includes a field-programmable-gate array (FPGA)
integrated-circuit (IC) chip configured to perform a logic function based on a truth table …

(60)(57) ABSTRACT Related US Application Data Provisional application No. 62/675,785,
filed on May 24, 2018, provisional application No. 62/729,527, filed on Sep. 11, 2018 …

G11C14/0054—Digital stores characterised by arrangements of cells having volatile and
non-volatile storage properties for back-up when the power is down in which the volatile …

(57) ABSTRACT A three-dimensional programmable interconnection system based on a
multi-chip package includes: a programmable metal bump or pad at a bottom of the multi …

H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid
state devices; Multistep manufacturing processes thereof all the devices being of a type …

DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C [C@@ H]
1CC [C@@] 2 (CC [C@@] 3 (C (= CC [C@ H] 4 [C@] 3 (CC [C@@ H] 5 [C@@] 4 (CC …