Recent advances in reactive ion etching and applications of high-aspect-ratio microfabrication
M Huff - Micromachines, 2021 - mdpi.com
This paper reviews the recent advances in reaction-ion etching (RIE) for application in high-
aspect-ratio microfabrication. High-aspect-ratio etching of materials used in micro-and …
aspect-ratio microfabrication. High-aspect-ratio etching of materials used in micro-and …
Pulsed plasma etching for semiconductor manufacturing
DJ Economou - Journal of Physics D: Applied Physics, 2014 - iopscience.iop.org
Power-modulated (pulsed) plasmas have demonstrated several advantages compared to
continuous wave (CW) plasmas. Specifically, pulsed plasmas can result in a higher etching …
continuous wave (CW) plasmas. Specifically, pulsed plasmas can result in a higher etching …
Plasma etching: Yesterday, today, and tomorrow
The field of plasma etching is reviewed. Plasma etching, a revolutionary extension of the
technique of physical sputtering, was introduced to integrated circuit manufacturing as early …
technique of physical sputtering, was introduced to integrated circuit manufacturing as early …
Principles of plasma discharges and materials processing
The authors have done an excellent job of clearly explaining the different nomenclature
used in plasma processing, with the meaning of the symbols and constants commonly …
used in plasma processing, with the meaning of the symbols and constants commonly …
Nanometer-scale photon confinement in topology-optimized dielectric cavities
Nanotechnology enables in principle a precise map** from design to device but relied so
far on human intuition and simple optimizations. In nanophotonics, a central question is how …
far on human intuition and simple optimizations. In nanophotonics, a central question is how …
[کتاب][B] MEMS materials and processes handbook
R Ghodssi, P Lin - 2011 - books.google.com
MEMs Materials and Processes Handbook" is a comprehensive reference for researchers
searching for new materials, properties of known materials, or specific processes available …
searching for new materials, properties of known materials, or specific processes available …
Black silicon method X: a review on high speed and selective plasma etching of silicon with profile control: an in-depth comparison between Bosch and cryostat DRIE …
An intensive study has been performed to understand and tune deep reactive ion etch
(DRIE) processes for optimum results with respect to the silicon etch rate, etch profile and …
(DRIE) processes for optimum results with respect to the silicon etch rate, etch profile and …
Challenges, developments and applications of silicon deep reactive ion etching
F Laermer, A Urban - Microelectronic Engineering, 2003 - Elsevier
High etching speed, good uniformity and profile control, high aspect ratio capabilities and
reliable notching suppression at dielectric interfaces are key requirements in the industrial …
reliable notching suppression at dielectric interfaces are key requirements in the industrial …
Deep reactive ion etching
This chapter discusses reactive ion etching (RIE) and deep RIE (DRIE) on wafers detailing
the various equipment and reactor requirements for different applications. The Bosch …
the various equipment and reactor requirements for different applications. The Bosch …
Molding of deep polydimethylsiloxane microstructures for microfluidics and biological applications
Here we demonstrate the microfabrication of deep (> 25 μm) polymeric microstructures
created by replica-molding polydimethylsiloxane (PDMS) from microfabricated Si substrates …
created by replica-molding polydimethylsiloxane (PDMS) from microfabricated Si substrates …