[BOOK][B] Three-dimensional integrated circuit design
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more
than twice as much new content, adding the latest developments in circuit models …
than twice as much new content, adding the latest developments in circuit models …
Design partitioning and layer assignment for 3D integrated circuits using tabu search and simulated annealing
ABSTRACT 3D integrated circuits (3D-ICs) is an emerging technology with lots of potential.
3D-ICs enjoy small footprint area and vertical interconnections between different dies which …
3D-ICs enjoy small footprint area and vertical interconnections between different dies which …
Architecture‐Level Exploration of Alternative Interconnection Schemes Targeting 3D FPGAs: A Software‐Supported Methodology
In current reconfigurable architectures, the interconnection structures increasingly contribute
more to the delay and power consumption. The demand for increased clock frequencies and …
more to the delay and power consumption. The demand for increased clock frequencies and …
Three-dimensional stacking FPGA architecture using face-to-face integration
T Hamada, Q Zhao, M Amagasaki… - 2013 IFIP/IEEE 21st …, 2013 - ieeexplore.ieee.org
In recent years, as VLSI process scales have developed into deep sub-micrometer
dimensions, routing delay problems have become critical. For reconfigurable logic devices …
dimensions, routing delay problems have become critical. For reconfigurable logic devices …
Interlaced switch boxes placement for three‐dimensional FPGA architecture design
CL Hsu, YS Huang, FC Lee - International Journal of Circuit …, 2012 - Wiley Online Library
SUMMARY Three‐dimensional (3D) field programmable gate array (FPGA) has evoked
significant interest in wire‐length reduction for routing requirement. However, the complex …
significant interest in wire‐length reduction for routing requirement. However, the complex …
A novel reconfigurable logic device base on 3D stack technology
Q Zhao, Y Iwai, M Amagasaki, M Iida… - … IEEE International 3D …, 2012 - ieeexplore.ieee.org
In recent years, as the VLSI process scale had been developed into deep sub-micro
dimension, the problem of the routing delay becomes critical. Especially for reconfigurable …
dimension, the problem of the routing delay becomes critical. Especially for reconfigurable …
DRAM-based FPGA enabled by three-dimensional (3d) memory stacking
Motivated by the emerging three-dimensional (3D integration technologies, this paper
studies the potential of applying 3D memory stacking to enable FPGA devices use on-chip …
studies the potential of applying 3D memory stacking to enable FPGA devices use on-chip …
Three dimensional FPGA architectures: A shift paradigm for energy-performance efficient DSP implementations
Modern applications exhibit increased complexity which introduces extra constraints during
implementation related to delay, power consumption and silicon area. This problem is even …
implementation related to delay, power consumption and silicon area. This problem is even …
On Through Silicon Vias as used in three dimensional integrated circuits
R Minvielle, M Bayoumi - 2013 4th Annual International …, 2013 - ieeexplore.ieee.org
This paper presents a survey of 3D Integrated Circuits using Through Silicon Vias (TSV). 3D
Integrated Circuits and the TSV will be defined, the rationale for moving to these systems will …
Integrated Circuits and the TSV will be defined, the rationale for moving to these systems will …
[PDF][PDF] Architectures and EDA for 3D FPGAs
HOU JUNSONG - 2014 - core.ac.uk
Research on 3D IC design is actively conducted for its high logic density and excellent
performance, compared with conventional 2D Integrated Circuit (IC) design. In this study, we …
performance, compared with conventional 2D Integrated Circuit (IC) design. In this study, we …