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Effect of electric current stressing on mechanical performance of solders and solder joints: A review
Mechanical performance is one of the most important factors influencing the reliability of
solder joints. Heretofore, plenty of works have been conducted on reliability of solder joints …
solder joints. Heretofore, plenty of works have been conducted on reliability of solder joints …
[HTML][HTML] A review on the fabrication and reliability of three-dimensional integration technologies for microelectronic packaging: Through-Si-via and solder bum** …
With the continuous miniaturization of electronic devices and the upcoming new
technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation …
technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation …
The reliability of lead-free solder joint subjected to special environment: a review
With the rapid development of electronical products, many primary challenges arise in the
field of design and manufacture, among which the property of electronical packaging …
field of design and manufacture, among which the property of electronical packaging …
[HTML][HTML] Advanced 3D Through-Si-Via and Solder Bum** Technology: A Review
Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for
achieving high-density integration, high-speed connectivity, and for downsizing of electronic …
achieving high-density integration, high-speed connectivity, and for downsizing of electronic …
Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix
Microstructure of the eutectic region and β-Sn grain of the solder matrix play an important
role in the properties of the Sn-based solder joint. In the present study, Ni and Co …
role in the properties of the Sn-based solder joint. In the present study, Ni and Co …
Grain size stability of interfacial intermetallic compound in Ni and Co nanoparticle-doped SAC305 solder joints under electromigration
In Sn-based solder joints, the size of interfacial IMC grains plays an important role in
determining the properties of solder joints. An effort has been made to investigate the effects …
determining the properties of solder joints. An effort has been made to investigate the effects …
[HTML][HTML] Role of crystallographic orientation of β-Sn grain on electromigration failures in lead-free solder joint: an overview
Due to the miniaturization of electronic devices, electromigration became one of the serious
reliability issues in lead-free solder joints. The orientation of the β-Sn grain plays an …
reliability issues in lead-free solder joints. The orientation of the β-Sn grain plays an …
Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint
Downscaling of electronic devices increased the current density in the solder joint. High
current density causes the rapid diffusion of Cu atoms which is the root cause of failure in …
current density causes the rapid diffusion of Cu atoms which is the root cause of failure in …
Effect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder joint
Brittle phases are responsible for crack formation and propagation in tin–bismuth (Sn–58Bi)
solder material. The purpose of this work is to investigate the effects of various cobalt (Co) …
solder material. The purpose of this work is to investigate the effects of various cobalt (Co) …
Current density dependent shear performance and fracture behavior of micro-scale BGA structure Cu/Sn–3.0 Ag–0.5 Cu/Cu joints under coupled electromechanical …
WK Le, X Ning, CB Ke, MB Zhou, XP Zhang - Journal of Materials Science …, 2019 - Springer
The shear performance and fracture behavior of micro-scale ball grid array (BGA) structure
Cu/Sn–3.0 Ag–0.5 Cu/Cu joints under coupled electromechanical loads with the increasing …
Cu/Sn–3.0 Ag–0.5 Cu/Cu joints under coupled electromechanical loads with the increasing …