Monolithic 3D integration as a pathway to energy-efficient computing and beyond: From materials and devices to architectures and chips

Y Fan, R An, J Tang, Y Li, T Liu, B Gao, H Qian… - Current Opinion in Solid …, 2024 - Elsevier
As emerging technologies like artificial intelligence (AI) and big data continue to evolve, the
demand for high-performance computing (HPC) has been increasing, driving the …

High-performance single-crystalline In2O3 field effect transistor toward three-dimensional large-scale integration circuits

S Yamazaki, F Isaka, T Ohno, Y Egi, S Tezuka… - Communications …, 2024 - nature.com
Formation of a single crystalline oxide semiconductor on an insulating film as a channel
material capable of three-dimensional (3D) stacking would enable 3D very-large-scale …

Extremely High-κ Hf0.2Zr0.8O2 Gate Stacks Integrated Into Eight Stacked Ge0.95Si0.05 Nanowires and Nanosheets nFETs to Boost ION

WJ Chen, YC Liu, YW Chen, YR Chen… - … on Electron Devices, 2023 - ieeexplore.ieee.org
By taking advantage of extremely high dielectric constant () of 47, the Hf0. 2Zr0. 8O2 gate
stacks are integrated into the eight stacked high mobility Ge0. 95Si0. 05 channels with low …

Top-gate indium-tin-oxide power transistors featuring high breakdown voltage of 156 V

J **e, Y Wang, Z Zheng, Y Kang, X Chen… - IEEE Electron …, 2024 - ieeexplore.ieee.org
In this letter, a top-gate (TG) indium-tin-oxide (ITO) power field-effect transistor (FET) with
offset design is reported for the first time and carefully investigated by both simulations and …

ALD Nanometer-Thin In2O3 for BEOL Logic, Memory and RF Applications

DY Peide - 2023 Silicon Nanoelectronics Workshop (SNW), 2023 - ieeexplore.ieee.org
Oxide semiconductors have been a mature technology in display-panel and recently
considered as promising back-end-of-line (BEOL) compatible channel materials for …