A review on single photon sources in silicon carbide

A Lohrmann, BC Johnson, JC McCallum… - Reports on Progress …, 2017 - iopscience.iop.org
This paper summarizes key findings in single-photon generation from deep level defects in
silicon carbide (SiC) and highlights the significance of these individually addressable …

Single-crystalline 3C-SiC anodically bonded onto glass: an excellent platform for high-temperature electronics and bioapplications

HP Phan, HH Cheng, T Dinh, B Wood… - … applied materials & …, 2017 - ACS Publications
Single-crystal cubic silicon carbide has attracted great attention for MEMS and electronic
devices. However, current leakage at the SiC/Si junction at high temperatures and visible …

A silicon-based surface code quantum computer

J O'Gorman, NH Nickerson, P Ross, JJL Morton… - npj Quantum …, 2016 - nature.com
Individual impurity atoms in silicon can make superb individual qubits, but it remains an
immense challenge to build a multi-qubit processor: there is a basic conflict between …

4H silicon carbide bulk acoustic wave gyroscope with ultra-high Q-factor for on-chip inertial navigation

Z Liu, Y Long, C Wehner, H Wen, F Ayazi - Communications …, 2024 - nature.com
Inertial navigation on a chip has long been constrained by the noise and stability issues of
micromechanical Coriolis gyroscopes, as silicon, the dominant material for …

Selective Undercut of Undoped Optical Membranes for Spin-Active Color Centers in 4H-Silicon Carbide

J Dietz, A **e, AM Day, EL Hu - ACS nano, 2025 - ACS Publications
Silicon carbide (SiC) is a semiconductor used in quantum information processing,
microelectromechanical systems, photonics, power electronics, and harsh environment …

Fabrication of SiC/Si, SiC/SiO2, and SiC/glass heterostructures via VUV/O3 activated direct bonding at low temperature

J Xu, C Wang, D Li, J Cheng, Y Wang, C Hang… - Ceramics …, 2019 - Elsevier
Low-temperature direct bonding is an effective method for joining two dissimilar materials
into one composite. In this paper, we developed a universal method for fabricating single …

Geometry and thickness dependant anomalous mechanical behavior of fabricated SU-8 thin film micro-cantilevers

AK Basu, A Basak… - Journal of …, 2020 - journals.sagepub.com
SU-8 micro-cantilever arrays consisting of V-and M-shaped structures fabricated using a
simplified single hard mask step. Bending tests were performed under similar peak loads …

Silicon carbide in microsystem technology—Thin Film versus bulk material

MA Fraga, M Bosi, M Negri - Advanced silicon carbide devices …, 2015 - books.google.com
This chapter looks at the role of silicon carbide (SiC) in microsystem technology. It starts with
an introduction into the wide bandgap (WBG) materials and the properties that make them …

Direct wafer bonding of SiC-SiC by SAB for monolithic integration of SiC MEMS and electronics

F Mu, K Iguchi, H Nakazawa, Y Takahashi… - ECS Journal of Solid …, 2016 - iopscience.iop.org
Although the monolithic integration of silicon carbide (SiC) Micro-Electro-Mechanical
Systems (MEMS) and SiC electronics is very promising, it is still very challenging due to the …

Selective removal of 4H-SiC porous structures caused by photoelectric chemical etching via post oxidation annealing

Y Li, S Zhao, S Yang, N Guo, W Yuan… - Semiconductor …, 2023 - iopscience.iop.org
Low-temperature post oxidation annealing of 4H-SiC at 900 C for 90 min after photoelectric
chemical (PEC) etching in alkaline solution can eliminate the porous structures that form …