Polyimide (PI) is one of the most dominant engineering plastics with excellent thermal,
mechanical, chemical stability and dielectric performance. Further improving the versatility of …

Thermal conductivity or heat dissipation of polymeric matrices is critical thermal feature for
both polymeric applications as well as process strategies. Polymeric matrices display …

Application of three-dimensional (3D) carbon framework in phase change material (PCM)
has aroused a tremendous interest. However, implementing a high alignment carbon …

The increasing demand of thermal management materials consumes a large amount of
petrochemical and inorganic mineral resources. It is essential to develop a kind of highly …

In this study, we developed a composite material for thermal conductivity by creating a
hyperbolic boron nitride (BN) and graphene oxide (GO) structure with surface treatment …

The accumulation of heat in electronic devices puts forward an urgent demand for thermal
interface materials. It is still a great challenge to achieve the good comprehensive …

In the preparation of high-performance polyimide (PI) thermally conductive composite films,
it is generally a challenge to improve both in-plane thermal conductivity (λin-plane) and out …

With the continuous development of electronic technology, polymer-based thermal
management materials (TMMs) with insulation, high thermal conductivity (TC), and low …

Owing to the rapid development of the latest micro-electronic devices, polymer composite
materials that combine high thermal conductivity and low permittivity have aroused the …

Polymer composites are ubiquitous and indispensable in numerous applications. Coupling
the inclusion of reinforcing agents with methods developed to control filler distribution and …