Abstract As Moore's Law comes to an end, the implementation of high-performance chips
through transistor scaling has become increasingly challenging. To improve performance …

In the post-Moore era, advanced packaging is becoming more critical to meet the everlasting
demands of electronic products with smaller size, more powerful performance and lower …

The chiplet architecture is one of the emerging methodologies and is believed to be scalable
and economical. However, most current multi-chiplet systems are based on one uniform die …

In modern cyber-physical systems, the integration of AI into vision pipelines is now a
standard practice for applications ranging from autonomous vehicles to mobile devices …

Nowadays, artificial intelligence (AI) technology with large models plays an increasingly
important role in both academia and industry. It also brings a rapidly increasing demand for …

Fast-evolving artificial intelligence (AI) algorithms such as large language models have
been driving the ever-increasing computing demands in today's data centers …

In recent years, nanotechnology and material science have evolved and matured, making it
easier and easier to design and fabricate next-generation 3D microelectronics. The process …

Fully Homomorphic Encryption (FHE) enables privacy-preserving computation and has
many applications. However, its practical implementation faces massive computation and …

Chiplet-based design, which breaks a system into multiple smaller dice (or “chiplets”) and
reassembles them into a new system chip through advanced packaging, has received …

The success of chiplet-based design critically depends on standards, especially those for
die-to-die interconnects. Universal Chiplet Interconnect Express (UCIe) is such a standard …