US9773742B2 - Embedded millimeter-wave phased array module - Google Patents
US9773742B2 - Embedded millimeter-wave phased array module - Google Patents Embedded …

US11063007B2 - Semiconductor device and method of manufacture - Google Patents
US11063007B2 - Semiconductor device and method of manufacture - Google Patents …

BACKGROUND Electronics can be divided into a simple hierarchy consist ing of devices
such as integrated circuit (IC) chips, packages, printed circuit boards (PCB), and systems …

Some embodiments relate to a semiconductor module com prising a low-cost integrated
antenna that uses a conductive backside structure in conjunction with a ground metal layer …

The present disclosure provides a semiconductor package, including a first semiconductor
structure, a first bonding dielectric over the first semiconductor structure and sur rounding a …

(57) ABSTRACT A method includes polishing a semiconductor substrate of a first die to
reveal first through-vias that extend into the semiconductor substrate, forming a dielectric …

(57) ABSTRACT A semiconductor package includes a first semiconductor device, a second
semiconductor device vertically positioned above the first semiconductor device, and a …

US9449945B2 - Filter and capacitor using redistribution layer and micro bump layer - Google
Patents US9449945B2 - Filter and capacitor using redistribution layer and micro bump layer …

Embodiments of an embedded mm-wave radio integrated circuit into a substrate of a phased
array module are disclosed. In some embodiments, the phased array module includes a first …

BACKGROUND Many modern day electronic devices use integrated anten nas (eg,
microstrip antennas) to communicate wirelessly with other electronic devices. Integrated …