Over the years, researchers have made significant strides in the development of novel
flexible/stretchable and conductive materials, enabling the creation of cutting-edge …

Solid-state Li-ion batteries employing a metallic lithium anode in conjunction with an
inorganic solid electrolyte (ISE) are expected to offer superior energy density and cycle life …

The shift to lead-free solder alternatives led to the development of Sn–Ag–Cu (SAC) alloys
as the most used solders due to their superior mechanical properties and reliability …

The rapid development of the third-generation semiconductors has posed new requirements
and challenges for power electronic packaging. In recent years, the utilization of nano-Ag …

In this study, cobalt (Co) particles were incorporated as reinforcing agents into the Sn58Bi
solder. The solderability of the solder and the strength of the solder joints were investigated …

The study investigated the growth kinetics and rate-controlling processes of intermetallic
layers formed at the interface between Cu and eutectic Sn–Bi alloys with Ag or Ni addition at …

Multi-principal element alloys (MPEA) demonstrate superior synergetic properties compared
to single-element predominated traditional alloys. However, the rapid melting and uniform …

In the post-Moore era, advanced packaging is becoming more critical to meet the everlasting
demands of electronic products with smaller size, more powerful performance and lower …

In the era of big data, the advantages of 3D packaging are becoming increasingly
significant. In addition, the mismatch between the coefficient of thermal expansion (CTE) of …

In this work, the electrochemical properties of micron In–Sn–Bi alloy electrodes for
rechargeable magnesium batteries (RMBs) are evaluated. Compared with the low stability …