Systems and methods for improved semiconductor etching and component protection
TF Tan, LK Loh, D Lubomirsky, J Soonwook… - US Patent …, 2019 - Google Patents
Semiconductor systems and methods may include a semiconductor processing chamber
having a gas box defining an access to the semiconductor processing chamber. The …
having a gas box defining an access to the semiconductor processing chamber. The …
Systems and methods for improved semiconductor etching and component protection
TF Tan, LK Loh, D Lubomirsky, J Soonwook… - US Patent …, 2019 - Google Patents
Semiconductor systems and methods may include a semi conductor processing chamber
having a gas box defining an access to the semiconductor processing chamber. The cham …
having a gas box defining an access to the semiconductor processing chamber. The cham …
Methods and systems to enhance process uniformity
3, 969077 4006047 4, 190488 4.209. 357 4,214,946 4, 232060 4.234. 628 4,265.943
4,340,462 4,341,592 4,361,418 4,364,803 4,368.223 4, 374698 4,381,441 4,397,812 …
4,340,462 4,341,592 4,361,418 4,364,803 4,368.223 4, 374698 4,381,441 4,397,812 …
Semiconductor processing systems having multiple plasma configurations
D Lubomirsky, X Chen, S Venkataraman - US Patent 10,256,079, 2019 - Google Patents
An exemplary system may include a chamber configured to contain a semiconductor
substrate in a processing region of the chamber. The system may include a first remote …
substrate in a processing region of the chamber. The system may include a first remote …
Dual-channel showerhead with improved profile
D Lubomirsky - US Patent 10,546,729, 2020 - Google Patents
Described processing chambers may include a chamber housing at least partially defining
an interior region of the semiconductor processing chamber. The chambers may include a …
an interior region of the semiconductor processing chamber. The chambers may include a …
Generation of compact alumina passivation layers on aluminum plasma equipment components
A process for generating a compact alumina passivation layer on an aluminum component
includes rinsing the component in deionized water for at least one minute, drying it for at …
includes rinsing the component in deionized water for at least one minute, drying it for at …
Conditioned semiconductor system parts
D Lubomirsky, SJ Kim - US Patent 9,885,117, 2018 - Google Patents
A method for conditioning a semiconductor chamber component may include passivating
the chamber component with an oxidizer. The method may also include performing a …
the chamber component with an oxidizer. The method may also include performing a …
Semiconductor processing system and methods using capacitively coupled plasma
JG Yang, ML Miller, X Chen, KN Chuc, Q Liang… - US Patent …, 2019 - Google Patents
Substrate processing systems are described that have a capacitively coupled plasma (CCP)
unit positioned inside a process chamber. The CCP unit may include a plasma excitation …
unit positioned inside a process chamber. The CCP unit may include a plasma excitation …
Silicon selective removal
Z Li, CM Hsu, H Zhang, J Zhang - US Patent 9,881,805, 2018 - Google Patents
A method of etching exposed silicon on patterned heterogeneous structures is described
and includes a gas phase etch using plasma effluents formed in a remote plasma. The …
and includes a gas phase etch using plasma effluents formed in a remote plasma. The …
Chemical control features in wafer process equipment
Q Liang, X Chen, K Chuc, D Lubomirsky, S Park… - US Patent …, 2018 - Google Patents
Gas distribution assemblies are described including an annular body, an upper plate, and a
lower plate. The upper plate may define a first plurality of apertures, and the lower plate may …
lower plate. The upper plate may define a first plurality of apertures, and the lower plate may …