Polymers are widely used in electronic packaging due to their easy processing, lightweight,
excellent insulation, and good mechanical properties. However, as electronic devices …

Thermal conductivity or heat dissipation of polymeric matrices is critical thermal feature for
both polymeric applications as well as process strategies. Polymeric matrices display …

Rapid development of energy, electrical and electronic technologies has put forward higher
requirements for the thermal conductivities of epoxy resins and their composites. However …

As the technological evolution of device miniaturization in electronics continues, interfacial
heat management is becoming increasingly crucial for protecting device functionality …

Polyimide (PI) has been widely used to manufacture flexible films in aerospace, electronics
and other fields because of its flexibility, thermal resistance, etc. However, the thermal …

Herein, we provided a structural design strategy of constructing boron nitride (BN) conformal
coating on the surface of the spherical graphite (SG) particles via precursors deposition and …

The high computility of electronic components put urgent requirements on the dissipation
efficiency of a high thermal conductive substrate. Herein, inspired by the nature structure …

ZrO 2 nanofiber aerogels with carbon as fiber junction were fabricated by freeze drying. The
effects of resorcinol-formaldehyde (RF) content and fiber content on the pore structure …

The improvement of anti‐corrosion performance and enhancement of functionality in anti‐
corrosion coatings are essential. Boron nitride (BN), as a two‐dimensional thermal …

The objective of this study is to test the feasibility to produce fully ceramic composites (ie,
without containing any metal phases) by binder jetting of alumina preforms and …