With compact footprint, low energy consumption, high scalability, and mass producibility,
chip‐scale integrated devices are an indispensable part of modern technological change …

Low‐and negative‐value (waste) products represent a valuable resource. Its use as a
source for the fabrication of high value materials represents a lucrative pathway to …

In this work, we synthesize a 43 nm thick layer of amorphous Al2O3 on transfer-free p-type
hydrogen-intercalated quasi-free-standing (QFS) epitaxial chemical vapor deposition …

The deposition of thin uniform dielectric layers on graphene is important for its successful
integration into electronic devices. We report on the atomic layer deposition (ALD) of Al2O3 …

In this study, we manufactured dielectric alumina (Al 2 O 3) ceramic tapes incorporated with
hexagonal boron nitride (hBN) for applications on high-frequency substrates. The ceramic …

We present the electrical characterization of wafer-scale graphene devices fabricated with
an industrially-relevant, contact-first integration scheme combined with Al 2 O 3 …

Accidental fire causes severe concerns all around the world, resulting in loss of property,
damaged ecosystem, pollution, and loss of human life. Majority of the fire accidents are due …

Two-dimensional materials (2DMs) have been widely investigated because of their potential
for heterogeneous integration with modern electronics. However, several major challenges …

With compact footprint, low energy consumption, high scalability, and mass producibility,
chip-scale integrated devices are an indispensable part of modern technological change …

While technologically challenging, the integration of ferroelectric thin films with graphene
spintronics potentially allows the realization of highly efficient, electrically tunable …