Couplenet: Coupling global structure with local parts for object detection

Y Zhu, C Zhao, J Wang, X Zhao… - Proceedings of the …, 2017 - openaccess.thecvf.com
Abstract The region-based Convolutional Neural Network (CNN) detectors such as Faster R-
CNN or R-FCN have already shown promising results for object detection by combining the …

An integrated built-in test and repair approach for memories with 2D redundancy

P Ohler, S Hellebrand… - 12th IEEE European Test …, 2007 - ieeexplore.ieee.org
An efficient on-chip infrastructure for memory test and repair is crucial to enhance yield and
availability of SoCs. Therefore embedded memories are commonly equipped with spare …

Zero-maintenance of electronic systems: Perspectives, challenges, and opportunities

R McWilliam, S Khan, M Farnsworth, C Bell - Microelectronics Reliability, 2018 - Elsevier
Self-engineering systems that are capable of repairing themselves in-situ without the need
for human decision (or intervention) could be used to achieve zero-maintenance. This …

[KÖNYV][B] Advanced test methods for SRAMs: effective solutions for dynamic fault detection in nanoscaled technologies

A Bosio, L Dilillo, P Girard, S Pravossoudovitch… - 2009 - books.google.com
Modern electronics depend on nanoscaled technologies that present new challenges in
terms of testing and diagnostics. Memories are particularly prone to defects since they …

[KÖNYV][B] Defect-oriented testing for nano-metric CMOS VLSI circuits

M Sachdev, JP De Gyvez - 2007 - books.google.com
Defect-oriented testing methods have come a long way from a mere interesting academic
exercise to a hard industrial reality. Many factors have contributed to its industrial …

A review paper on memory fault models and test algorithms

AZ Jidin, R Hussin, LW Fook… - Bulletin of Electrical …, 2021 - mail.beei.org
Testing embedded memories in a chip can be very challenging due to their high-density
nature and manufactured using very deep submicron (VDSM) technologies. In this review …

A memory yield improvement scheme combining built-in self-repair and error correction codes

TH Wu, PY Chen, M Lee, BY Lin, CW Wu… - 2012 IEEE …, 2012 - ieeexplore.ieee.org
Error correction code (ECC) and built-in self-repair (BISR) schemes have been wildly used
for improving the yield and reliability of memories. Many built-in redundancy-analysis (BIRA) …

Low-cost memory fault tolerance for IoT devices

M Gottscho, I Alam, C Schoeny, L Dolecek… - ACM Transactions on …, 2017 - dl.acm.org
IoT devices need reliable hardware at low cost. It is challenging to efficiently cope with both
hard and soft faults in embedded scratchpad memories. To address this problem, we …

Modeling TSV open defects in 3D-stacked DRAM

L Jiang, Y Liu, L Duan, Y **e… - 2010 IEEE International …, 2010 - ieeexplore.ieee.org
Three-dimensional (3D) stacking using through silicon vias (TSVs) is a promising solution to
provide low-latency and high-bandwidth DRAM access from microprocessors. The large …

12 Infrastructure Intellectual Property for SoC Simulation and Diagnosis Service

V Hahanov - Design of digital systems and devices, 2011 - Springer
The models and methods for creating Infrastructure Intellectual Property (I-IP) service for the
functionalities System on Chip (SoC), which has a minimum set of the real time Built-In Self …