Abstract Electrodeposited Invar Fe–Ni alloys with 36 to 40 mass% Ni were prepared from
plating baths containing saccharin as a stress reducer and containing various Fe 2+ …

In general, creation of superhydrophobic surfaces is composed of two steps:(i) creation of a
rough surface and (ii) passivation of the surface with the low surface energy molecules or …

Interfacial voiding in solder joints formed with Sn–Ag–Cu solder alloys and electroplated Cu
was examined as a function of the plating solution chemistry and parameters. Galvanostatic …

Nickel-iron alloy coatings were produced by electrodeposition from an additive free
electrolyte, at room temperature and current density in the range of 1 to 5 A dm− 2, with Fe …

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The effect of Fe3+ concentration on saturation magnetic flux density (Bs) of electrodeposited
Co40–44Fe60–56 films was investigated. The results show that if the conditions at the …

In many electronic devices, a time-dependent degradation of the drop/impact reliability of
solder joints with electrodeposited Cu has been an issue to date. This problem has been …

Electrodeposition of thick 2.4 T CoFe films with 60–63 wt% Fe was achieved at various
solution pH values (2.0, 2.2, 2.3, 2.4, 2.6, and 2.8) in the presence of saccharin on 6 in. AlTiC …

Nickel–phosphorus deposits with various phosphorus contents and internal stresses were
electroplated from a nickel sulfamate bath without an additive by varying the duty cycle and …

Incorporation of sulfur into alloys during galvanostatic deposition has been studied. The
results indicate that the main source of sulfur in magnetic deposit is saccharin used as an …