Conspectus Gold (Au), a transition metal with an atomic number of 79 in the periodic table of
elements, was discovered in approximately 3000 BC Due to the ultrahigh chemical stability …

Due to the advantages of small form factor, high performance, low power consumption, and
high density integration, three-dimensional integrated circuits (3D ICs) have been generally …

Due to the demand for high-performance electronic products, there has been a rapid
development in three-dimensional integrated circuit (3D IC) packaging technology. The 3D …

The mean-time-to-failure (MTTF) associated with microbumps is a pivotal factor influencing
the reliability of cutting-edge consumer electronic devices. Within Sn-based solder joints, the …

Highly disperse and reactive (HfB 2–SiC)@(Ta 2 O 5–HfO 2–C) composite powders were
manufactured by sol–gel technology where Ta 2 O 5–HfO 2–C amorphous components …

For a Cu single crystal, we find that indentation hardness increases with decreasing
indentation depth, a phenomenon widely observed before and called the indentation size …

This paper reports the extreme sensitivity of the microstructure evolution in Sn-Ag-Cu (SAC)
micro-solder joint, consisting of 15–20 µm thick solder alloy and electrolytic Ni plated Cu …

Dislocation segments with Burgers vector b=〈 100〉 are formed during deformation of body-
centred-cubic (bcc) metals by the interaction between dislocations with b= 1/2〈 111〉. Such …

Ni barrier symmetry effect on the electromigration (EM) failure mechanism of Cu/Sn–Ag
microbump were systematically investigated by studying the intermetallic compound (IMC) …

FeCo nanocapsules with FeCo alloy as core and amorphous Al 2 O 3 as shell have been
synthesized by a modified arc-discharge technique. Three-dimensional coral-like …