The integrated circuits industry has been continuously producing microelectronic
components with ever higher integration level, packaging density, and power density, which …

Polymers are widely used in industry and in our daily life because of their diverse
functionality, light weight, low cost and excellent chemical stability. However, on some …

The miniaturization of electronic devices often gives rise to heat accumulation and sudden
thermal shocks, which can pose risks to both the device and its users. To address this issue …

High thermal conductivity, structural stability, good mechanical and anti-oxidant properties
makes hexagonal boron nitride (h-BN) a promising functional filler for polymers to produce …

Thermal conductivity has become an important parameter for new technologies, especially
in aerospace and aeronautics. The advanced materials used in some electronic applications …

Epoxy resin has been widely used in electrical and electronics industries due to its excellent
adhesion and insulating properties. However, the low thermal conductivity limits its …

Carbon fiber/poly ether ether ketone (Cf/PEEK) composites are a class of high performance,
continuous fiber reinforced thermoplastic polymer materials. These composites have the …

The increased heat generated in high-density electronics has intensified the search for
advanced thermal management solutions. This urge has prompted fundamental studies on …

Helmet inner liner (HIL) is a critical component of helmets which ensures safety and comfort
of the wearer. Efforts are made in this work to qualify polyurethane (PU) foams for HIL …

In this paper, a stellated carbon filler (S-filler) through passivation of the surfaces of carbon
nanotubes and carbon black (CNTs/CB) was fabricated, and the corresponding thermal …