A roadmap review of thermally conductive polymer composites: critical factors, progress, and prospects

Z Wang, Z Wu, L Weng, S Ge, D Jiang… - Advanced Functional …, 2023 - Wiley Online Library
Recently, the need for miniaturization and high integration have steered a strong technical
wave in develo** (micro‐) electronic devices. However, excessive amounts of heat may …

Advances on thermally conductive epoxy‐based composites as electronic packaging underfill materials—a review

Y Wen, C Chen, Y Ye, Z Xue, H Liu, X Zhou… - Advanced …, 2022 - Wiley Online Library
The integrated circuits industry has been continuously producing microelectronic
components with ever higher integration level, packaging density, and power density, which …

Heterogeneous interfaces and 3D foam structures synergize to build superior electromagnetic wave absorbers

Z Jia, D Lan, M Chang, Y Han, G Wu - Materials Today Physics, 2023 - Elsevier
Composite of magnetic materials with two-dimensional semiconductor Mxene is a common
way to design electromagnetic wave absorbing (EWA) materials, but the lack of three …

Dual strategy of A-site ion substitution and self-assembled MoS2 wrap** to boost permittivity for reinforced microwave absorption performance

A Feng, D Lan, J Liu, G Wu, Z Jia - Journal of Materials Science & …, 2024 - Elsevier
With the rapid development of electronic technology, how to effectively eliminate
electromagnetic pollution has become a serious problem. Perovskite oxides have shown …

Multiphase interfacial regulation based on hierarchical porous molybdenum selenide to build anticorrosive and multiband tailorable absorbers

T Zhao, Z Jia, J Liu, Y Zhang, G Wu, P Yin - Nano-Micro Letters, 2024 - Springer
Electromagnetic wave (EMW) absorbing materials have an irreplaceable position in the field
of military stealth as well as in the field of electromagnetic pollution control. And in order to …

Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging

R Li, X Yang, J Li, Y Shen, L Zhang, R Lu, C Wang… - Materials today …, 2022 - Elsevier
Polymers are widely used in electronic packaging due to their easy processing, lightweight,
excellent insulation, and good mechanical properties. However, as electronic devices …

[HTML][HTML] Recent advances in thermal-conductive insulating polymer composites with various fillers

Q Chen, K Yang, Y Feng, L Liang, M Chi… - Composites Part A …, 2024 - Elsevier
Abstract Development of polymer-based composites with excellent thermal conductivity and
electrical insulation properties is a hot research topic, because more and more electrical …

Modulation engineering of electromagnetic wave absorption performance of layered double hydroxides derived hollow metal carbides integrating corrosion protection

Z Zhou, X Zhou, D Lan, Y Zhang, Z Jia, G Wu, P Yin - Small, 2024 - Wiley Online Library
Layered double hydroxides (LDHs) with unique layered structure and atomic composition
are limited in the field of electromagnetic wave absorption (EMA) due to their poor electrical …

Factors affecting thermal conductivities of the polymers and polymer composites: A review

Y Guo, K Ruan, X Shi, X Yang, J Gu - Composites Science and Technology, 2020 - Elsevier
It is of considerable scientific and technological importance to enhance the thermal
conductivity coefficient (λ) values of the polymers and polymer composites. Limited …

Recent advances in multilayer‐structure dielectrics for energy storage application

M Feng, Y Feng, T Zhang, J Li, Q Chen… - Advanced …, 2021 - Wiley Online Library
An electrostatic capacitor has been widely used in many fields (such as high pulsed power
technology, new energy vehicles, etc.) due to its ultrahigh discharge power density …