(57) ABSTRACT A die package is described that includes a substrate to carry passive
components. In one example, the package has a semiconductor die having active circuitry …

(57) ABSTRACT A chip-stacked semiconductor package including a first chip having a
plurality of first real bump pads and a plurality of first dummy bump pads, a second chip on …

BACKGROUND Chip scale packages (CSP) are widely adopted for semi conductor chip
assemblies in the industry because the com ponent has a smaller size. A popular …

An antenna that is formed of a conductor pattern is disposed on a dielectric substrate. A high-
frequency semiconductor device that supplies a high-frequency signal to the antenna is …

(57) ABSTRACT A glass-based, high-performance 60 GHZ/mm-wave antenna includes
cavities disposed in a phased-array antenna (PAA) Substrate. The cavities are disposed …

Package structures are provided for integrally packaging antennas with semiconductor RFIC
(radio frequency integrated circuit) chips to form compact integrated radio/wireless …

Embodiments of the invention include a microelectronic device that includes a first substrate
having organic dielec tric material, conductive layers, and a first portion of a distributed …

G06F1/1698—Constructional details or arrangements related to integrated I/O peripherals
not covered by groups G06F1/1635-G06F1/1675 the I/O peripheral being a …

A semiconductor package structure is provided. The semiconductor package structure
includes a semiconductor die surrounded by a first molding compound layer. A redistribution …

An electronic package and a method for fabricating the same are provided. The method
includes disposing an electronic component on a lower side of a first carrier and forming an …