In one embodiment, semiconductor die are singulated from a semiconductor wafer by
placing the semiconductor wafer onto a carrier tape, forming singulation lines through the …

BACKGROUND 1) Field Embodiments of the present invention pertainto the field of
semiconductor processing and, in particular, to methods of dicing semiconductor wafers …

(57) ABSTRACT A semiconductor device includes a substrate having a chan nel region; a
gate stack over the channel region; a seal spacer covering a sidewall of the gate stack, the …

Laser and plasma etch wafer dicing where a mask is formed covering ICs formed on the
wafer, as well as any bumps providing an interface to the ICs. The semiconductor wafer is …

US9472458B2 - Method of reducing residual contamination in singulated semiconductor
die - Google Patents US9472458B2 - Method of reducing residual contamination in …

Laser and plasma etch wafer dicing using UV-curable adhe sive films. A mask is formed
covering ICs formed on the wafer, as well as any bumps providing an interface to the ICs …

BACKGROUND 1) Field Embodiments of the present invention pertain to the? eld of
semiconductor processing and, in particular, to methods of dicing semiconductor wafers …

Page 2 mask is direct-write patterned with a laser scribing process to provide a patterned
mask with gaps. The patterning exposes regions of the substrate between the ICs …

Alternating masking and laser scribing approaches for wafer dicing using laser scribing and
plasma etch are described. In an example, a method ofdicing a semiconductor wafer having …

(57) ABSTRACT A method for processing electronic die includes providing a substrate
having a plurality of electronic die formed as part of the substrate and separated from each …