Terahertz radiation for inspection and fault detection has been of interest for the
semiconductor industry since the first generation and detection of THz signals. Until recent …

Fully oriented-intermetallic interconnects (FOI) of high melting point and service
performance have highly considerable potential application in the current generation of 3D …

This article provides a novel 3-D die-to-wafer (D2W) bonding method using intermetallic
compound (IMC) layer insertion into a soft Sn bump to generate mechanical connection of …

This article presents a methodology to investigate, in situ, the interfacial solid-state reaction
of alternative metallurgical systems, such as Cu/Ni/Sn and Ni/Cu/Sn bumps. The …

In this study, the effects of reflow temperature, reflow time, and substrates (polycrystalline
and (001/110/111) monocrystalline Cu substrates) on the growth of Cu3Sn at the Cu/Sn3Ag …

The current miniaturization trend of microelectronic devices drives the size of solder joints to
continually scale down. The miniaturized joints considerably increase intermetallic …

The pursuit of higher packing density has propelled the shift towards three-dimensional (3D)
integrated circuits (3D-ICs), promising heightened performance, accelerated data speeds …

The article presents a hardware and software system used for functional testing of NAND-
memory chips based on FPGA. The system's module structure allows simultaneous testing …

In the previous chapter, the concept of the SoC, where all system circuitry is placed on one
die, and that die is packaged, was discussed. It was stated that SoC packaging is often …

This thesis presents a study on the formation mechanism of porous Cu 3 Sn intermetallic
compounds in microbumps for 3D-IC packaging, which are issues of importance to the …