Temperature is a critical—yet sometimes overlooked—parameter in microfluidics.
Microfluidic devices can experience heating inside their channels during operation due to …

Using microfluidic cooling to achieve thermal management of three-dimensional integrated
circuits (ICs) is recognized as a promising method of extending Moore law progression in …

Abstract Effect of micro pin-fin shapes on cooling of high heat flux electronic chips with a
single hot spot was investigated numerically. Hydrothermal performances of different micro …

Microfluidic cooling has been demonstrated as an effective means of cooling microelectronic
circuits with a very low convective thermal resistance and potential for integration in close …

Three-dimensional (3D) stacked integrated circuit (IC) chips offer significant performance
improvement, but offer important challenges for thermal management including, for the case …

Cutter runout is universal and inevitable in milling process and has a direct impact on the
shape of the in-process geometry. However, most of the works on the cutter-workpiece …

This article presents the electrical circuit model of signal-ground through-silicon vias (TSVs)
in a silicon microfluidic pin-fin heat sink in which the pin-fins are surrounded by deionized …

Microfluidic cooling shows promise in cooling next generation 3D microsystems when
integrated with through-silicon-vias. In this work, electrical and thermal effects of staggered …

In this article, an efficient approach based on the parallel alternating direction implicit (ADI)
method is presented for the transient thermal simulation of liquid-cooled 3-D integrated …

This paper reports on novel thermal testbeds with embedded micropin-fin heat sinks that
were designed and microfabricated in silicon. Two micropin-fin arrays were presented, each …