Our work proposed a facile strategy for selective fabrication of the precise metalized patterns
onto polymer substrates through the laser direct structuring (LDS) technology using …

Abstract Tricyclazole (TCA), a nitrogen-containing heterocyclic compound, is employed as
potential leveler for microvia filling with electroplating copper. The leveler is characterized by …

Two water-soluble N-containing additives without sulfur and phosphorus, hexanamide with
tetraethylenepentamine (EEHA) and benzotriazole amide with diethylenetriamine (BTAA) …

In this study, a novel scribing–seeding–plating (SSP) process for the fabrication of copper
circuits with a strong adhesion strength of 39.68 N cm− 1 and a high conductivity of 4.69× …

To solve the problems of a conventional subtractive process for preparing conductive
circuits, numerous alternative additive processes have been investigated, such as screen or …

The flexible electrodes with excellent electrical and mechanical performance play critical
and fundamental roles in the wearable electronics. In this work, highly conductive and …

In the present work, the synergistic effects of two corrosion inhibitors, thiourea and
benzotriazole, on the corrosion behavior of copper in 1 M H2SO4 solution was investigated …

Fabrication of conductive patterns by selective electroless plating is a widely studied
process in recent years for its advantages of lower waste, simpler process, less pollution and …

The article reports on the fabrication of metallic nanomaterial on conducting polyaniline
patterns. Topics discussed include techniques for creating metallic nanoparticle patterns …