This paper reviews the function and importance of Sn‐Ag‐Cu solder alloys in electronics
industry and the interfacial reaction of Sn‐Ag‐Cu/Cu solder joint at various solder forms and …

The microstructural evolution of η (Cu6Sn5) and ε (Cu3Sn) in a Cu/Sn/Cu structure under
transient liquid phase bonding conditions is numerically investigated through the use of the …

We investigate the early stages of the morphological evolution of intermetallic compounds
(IMCs) during lead-free soldering involving liquid Sn-based solder and Cu substrate …

This study investigates the concurrent nucleation, formation and growth of two intermetallic
compounds (IMCs), Cu6Sn5 (η) and Cu3Sn (ε), during the early stages of soldering in the …

The interfacial reactions between two Sn-Cu (Sn-0.7 Cu and Sn-3Cu, wt.%) ball-grid-array
(BGA) solders and the Au/Ni/Cu substrate by solid-state isothermal aging were examined at …

Three lead-free solder alloys, Sn–3Ag–0.5 Cu, Sn–3Ag–0.5 Cu–1Bi and Sn–3Ag–0.5 Cu–
3Bi, have been used to solder with Cu substrate in the current experiments to investigate the …

In this work, we present a preliminary model based on the multiphase-field formalism that is
used to investigate the evolution of intermetallic compound (IMC) layers in the Cu/Sn solder …

Phase field simulations of the microstructural evolution of the intermetallic compound (IMC)
layer formed during isothermal soldering reactions between Sn-Cu solder alloys and a Cu …

This study investigated the effect of massive spalling of intermetallic compounds (IMCs) on
the microstructural evolution and mechanical properties of solder joints after multiple …

The non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by
electromigration was investigated, for the first time, under room temperature. The sub-micron …