The urgent need for ultrahigh thermally conductive materials to keep up with the rapid
development of the electronics industry has led to the exploration of hexagonal boron nitride …

Abstract Development of polymer-based composites with excellent thermal conductivity and
electrical insulation properties is a hot research topic, because more and more electrical …

With the innovation of microelectronics technology, the heat dissipation problem inside the
device will face a severe test. In this work, cellulose aerogel (CA) with highly enhanced …

Replacing petroleum-based products with inexpensive, biorenewable, natural materials is
important for sustainable development and will have a significant impact on the polymer …

In the field of modern microelectronic packaging materials, there is a great need for polymer-
based composites with both excellent thermal conduction and flame retardancy properties …

The development of modern electronics and equipment, especially those with high power
density, has long relied on rapid heat dissipation of integrated chips, yet a challenge to date …

The polymer nanocomposites with 3-dimensional (3D) nanofillers can form a 3D network
and attain a uniform distribution of nanofillers, which benefits the transfer of charge carriers …

Multifunctional materials with high-efficiency microwave absorption properties and effective
thermal conductivity are urgently required for modern electronic devices and systems …

Hexagonal boron nitride (h-BN)/epoxy composites with high through-plane thermal
conductivity were successfully fabricated using core-shell h-BN/epoxy (e-BN) microspheres …

With the continuous innovation of electronic information technology, thermal interface
materials, which mainly play the role of heat dissipation in microelectronic devices, will face …