Selective area regrowth and do** for vertical gallium nitride power devices: Materials challenges and recent progress

H Fu, K Fu, C Yang, H Liu, KA Hatch, P Peri… - Materials Today, 2021 - Elsevier
This paper reviews materials challenges and recent progress for selective area regrowth
and do** for vertical gallium nitride (GaN) power devices. The purpose is to realize …

Improvement of channel property of GaN vertical trench MOSFET by compensating nitrogen vacancies with nitrogen plasma treatment

T Ishida, KP Nam, M Matys, T Uesugi… - Applied Physics …, 2020 - iopscience.iop.org
The electrical properties of vertical GaN trench MOSFETs without drift layers were evaluated
to investigate the effect of nitrogen plasma treatment on the trench sidewalls. It is …

Selective epitaxial growth of monolithically integrated GaN-based light emitting diodes with AlGaN/GaN driving transistors

Z Liu, J Ma, T Huang, C Liu, K May Lau - Applied Physics Letters, 2014 - pubs.aip.org
In this Letter, we report selective epitaxial growth of monolithically integrated GaN-based
light emitting diodes (LEDs) with AlGaN/GaN high-electron-mobility transistor (HEMT) …

Etching-induced damage in heavily Mg-doped p-type GaN and its suppression by low-bias-power inductively coupled plasma-reactive ion etching

T Kumabe, Y Ando, H Watanabe, M Deki… - Japanese Journal of …, 2021 - iopscience.iop.org
Inductively coupled plasma–reactive ion etching (ICP–RIE)-induced damage in heavily Mg-
doped p-type GaN ([Mg]= 2× 10 19 cm− 3) was investigated by low-temperature …

Direct measurement of band offset at the interface between CdS and Cu2ZnSnS4 using hard X-ray photoelectron spectroscopy

S Tajima, K Kataoka, N Takahashi, Y Kimoto… - Applied Physics …, 2013 - pubs.aip.org
We directly and non-destructively measured the valence band offset at the interface between
CdS and Cu 2 ZnSnS 4 (CZTS) using hard X-ray photoelectron spectroscopy (HAXPES) …