Analysis of crosstalk effects for multiwalled carbon nanotube bundle interconnects in ternary logic and comparison with Cu interconnects
MR Khezeli, MH Moaiyeri… - IEEE Transactions on …, 2016 - ieeexplore.ieee.org
In this study, the crosstalk-induced effects are investigated in ternary logic by using the three-
line bus architecture. The worst case crosstalk delays for both repeated and unrepeated …
line bus architecture. The worst case crosstalk delays for both repeated and unrepeated …
Efficient passive shielding of MWCNT interconnects to reduce crosstalk effects in multiple-valued logic circuits
MH Moaiyeri, ZM Taheri, MR Khezeli… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
In this paper, the effectiveness of passive shielding of multiwalled carbon nanotube
(MWCNT) bundle interconnects in reducing the crosstalk effects in carbon nanotube FET …
(MWCNT) bundle interconnects in reducing the crosstalk effects in carbon nanotube FET …
Active shielding of MWCNT bundle interconnects: an efficient approach to cancellation of crosstalk-induced functional failures in ternary logic
MR Khezeli, MH Moaiyeri… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
This study presents an efficient geometry for active shielding of multiwalled carbon nanotube
(MWCNT) bundle interconnects which cancels the crosstalk-induced functional failures in …
(MWCNT) bundle interconnects which cancels the crosstalk-induced functional failures in …
Comparative analysis of simultaneous switching noise effects in MWCNT bundle and Cu power interconnects in CNTFET-based ternary circuits
MR Khezeli, MH Moaiyeri… - IEEE Transactions on Very …, 2018 - ieeexplore.ieee.org
In this paper, the impacts of the simultaneous switching noise (SSN) in carbon nanotube
field effect transistor-based ternary circuits are investigated. These effects, including the …
field effect transistor-based ternary circuits are investigated. These effects, including the …
Comparative analysis of the crosstalk effects in multilayer graphene nanoribbon and MWCNT interconnects in sub-10 nm technologies
In this paper, the crosstalk effects in multilayer graphene nanoribbon (MLGNR)
interconnects are evaluated and are compared with those in multiwalled carbon nanotube …
interconnects are evaluated and are compared with those in multiwalled carbon nanotube …
Mathematical framework of tetramorphic MWCNT configuration for VLSI interconnect
Having a 1D material like Multiwall Carbon Nanotube (MWCNT) as a potential candidate for
high speed Very Large Scale Integration (VLSI) interconnect creates a good scope to reduce …
high speed Very Large Scale Integration (VLSI) interconnect creates a good scope to reduce …
Future dielectric materials for CNT interconnects-possibilities and challenges
Carbon nanotube (CNT) interconnects are emerging as the ultimate choice for next
generation ultra large scale integrated (ULSI) circuits. Significant progress in precise growth …
generation ultra large scale integrated (ULSI) circuits. Significant progress in precise growth …
Comprehensive model for high-speed current-mode signaling in next generation MWCNT bundle interconnect using FDTD technique
The performance of current-mode signaling (CMS) scheme in carbon nanomaterial based
multiwall carbon nanotube (MWCNT) bundle on-chip interconnect using finite-difference …
multiwall carbon nanotube (MWCNT) bundle on-chip interconnect using finite-difference …
A theoretical modeling of adaptive mixed cnt bundles for high-speed vlsi interconnect design
The aroused quest to reduce the delay at the interconnect level is the main urge of this
paper, so as to come across a configuration of carbon nanotube (CNT) bundles, namely …
paper, so as to come across a configuration of carbon nanotube (CNT) bundles, namely …
Comparative radio‐frequency and crosstalk analysis of carbon‐based nano‐interconnects
A comparative radio‐frequency (RF) and crosstalk analysis is performed on carbon nano‐
interconnects based on an efficient π‐type equivalent single‐conductor model of bundled …
interconnects based on an efficient π‐type equivalent single‐conductor model of bundled …