The continuous improvement of electronic device performances and the advancement of
packaging technology have brought greater challenges to the reliability of solder joints in …

During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used
extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi …

Abstract Package-on-Package (PoP) is a popular technology for fabricating chipsets of
accelerated processing units. However, the coefficient of thermal expansion mismatch …

In recent years, in order to adapt to the trend of low-temperature assembly and integration,
low-temperature hybrid solders with multiple elements added to the tin solder matrix have …

Sn–Bi-based solder alloys have sparked tremendous research interest towards the
development of low-temperature interconnecting materials in multi-level packaging …

The development of hybrid solder for chip packing is a major 3D packaging research topic.
The incorporation of with low melting points into solder materials has been used in low …

In the quest for viable alternatives to lead-based solders, electronic industries have started
to focus on several potential lead-free solder alloys. After reviewing more than 100 recent …

In order to improve the mechanical properties after thermal aging of an Sn–45Bi–2.6 Zn
(SBZ) alloy, which we had proposed in a previous study, in this study, we prepared Sn–Bi …

In this study, the influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction
and fracture behavior of the aged SnBiAg/Cu solder joints were investigated. The results …