Due to the miniaturization of electronic devices, electromigration became one of the serious
reliability issues in lead-free solder joints. The orientation of the β-Sn grain plays an …

Herein, we report the synthesis of novel nickel ferrite doped with yttrium nanocomposite
(NiFe2− x Y x O4 represented as NFY) thin film with multifunctional features such as …

This study proposes a low-temperature transient liquid phase bonding (TLPB) method using
Sn58Bi/porous Cu/Sn58Bi to enable efficient power-device packaging at high temperatures …

Downscaling of electronic devices increased the current density in the solder joint. High
current density causes the rapid diffusion of Cu atoms which is the root cause of failure in …

Abstract Eutectic Sn–Bi alloy is acquiring significant observation in the electronic packaging
industry because of its advantageous properties such as ductility, low melting temperature …

The influence of multi-walled carbon nanotube (MWCNT) content on the melting properties,
wettability, microstructure, and intermetallic compounds (IMCs) of Sn-58Bi-x MWCNT (x= 0 …

Migration of Cu atoms from the cathode side to the anode side causes void formation in the
solder joint, which is the root cause of electromigration failures in lead-free solder joints. This …

Miniaturization of electronic devices causes reliability issues in solder joints such as a
reduction in mechanical, structural, and electrical properties. This work focuses on studying …