Abstract In recent years, Cu–Sn solid–liquid interdiffusion (SLID) bonding has been used in
semiconductor packaging, die-attach, fine-pitch interconnection, and through-silicon vias …

Abstract Large Ag 3 Sn plates in solder joints can affect the reliability of electronics,
however, the factors affecting their nucleation and morphology are not well understood …

The past two decades have witnessed the rapid development of nanocalorimetry, a novel
materials characterization technique that employs micromachined calorimetric sensors. The …

The composition of alloying elements in Sn-rich solder plays a pivotal role in determining the
performance of solder joints in an electronic package. Recently, Indium (In) has attracted …

The directional coefficient of thermal expansion (CTE) of intermetallics in electronic
interconnections is a key thermophysical property that is required for microstructure-level …

This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the
microstructure, electrical, wettability and mechanical properties of the Sn-0.7 Cu-0.05 Ni as a …

The effects of Mn addition (0.005, 0.01, 0.03, 0.05, and 0.07 wt.%) on microstructure, shear
mechanical behavior, and interfacial thermal stabilities of SAC305 joints were investigated …

The liquid/solid (L/S) interface of dissimilar metals is critical to the microstructure,
mechanical strength, and structural integrity of interconnects in many important applications …

This paper elucidated the microstructural and porosity evolution of alkali activated slag at
800° C up to 1200° C. The microstructural analysis obtained shows the changes in surface …

Cu 6 Sn 5 is an important intermetallic for electric interconnects and anode material of Li-ion
batteries, with a polymorphic transformation from hexagonal eta-Cu 6 Sn 5 at temperatures …