Micro/nanoscale 3D assembly by rolling, folding, curving, and buckling approaches
The miniaturization of electronics has been an important topic of study for several decades.
The established roadmaps following Moore's Law have encountered bottlenecks in recent …
The established roadmaps following Moore's Law have encountered bottlenecks in recent …
Three-dimensional integrated circuit (3D IC) key technology: Through-silicon via (TSV)
WW Shen, KN Chen - Nanoscale research letters, 2017 - Springer
Abstract 3D integration with through-silicon via (TSV) is a promising candidate to perform
system-level integration with smaller package size, higher interconnection density, and …
system-level integration with smaller package size, higher interconnection density, and …
Fabrication of sharp silicon hollow microneedles by deep-reactive ion etching towards minimally invasive diagnostics
Y Li, H Zhang, R Yang, Y Laffitte, U Schmill… - Microsystems & …, 2019 - nature.com
Microneedle technologies have the potential for expanding the capabilities of wearable
health monitoring from physiology to biochemistry. This paper presents the fabrication of …
health monitoring from physiology to biochemistry. This paper presents the fabrication of …
A novel microscale selective laser sintering (μ-SLS) process for the fabrication of microelectronic parts
One of the biggest challenges in microscale additive manufacturing is the production of
three-dimensional, microscale metal parts with a high enough throughput to be relevant for …
three-dimensional, microscale metal parts with a high enough throughput to be relevant for …
Three-dimensional silicon integration
JU Knickerbocker, PS Andry, B Dang… - IBM Journal of …, 2008 - ieeexplore.ieee.org
Three-dimensional (3D) silicon integration of active devices with through-silicon vias (TSVs),
thinned silicon, and silicon-to-silicon fine-pitch interconnections offers many product …
thinned silicon, and silicon-to-silicon fine-pitch interconnections offers many product …
Monolithic and heterogeneous three-dimensional integration of two-dimensional materials with high-density vias
Monolithic three-dimensional (M3D) integration is being increasingly adopted by the
semiconductor industry as an alternative to traditional through-silicon via technology as a …
semiconductor industry as an alternative to traditional through-silicon via technology as a …
CELONCEL: Effective design technique for 3-D monolithic integration targeting high performance integrated circuits
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential
technology for future gigascale circuits. Since the device layers are processed in sequential …
technology for future gigascale circuits. Since the device layers are processed in sequential …
Performance analysis of 3-D monolithic integrated circuits
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential
technology for future gigascale circuits. Since the device layers are processed in sequential …
technology for future gigascale circuits. Since the device layers are processed in sequential …
Ultimate monolithic-3D integration with 2D materials: rationale, prospects, and challenges
As a possible pathway to continue Moore's law indefinitely into the future as well as
unprecedented beyond-Moore heterogeneous integration, we examine the prospects of …
unprecedented beyond-Moore heterogeneous integration, we examine the prospects of …
Semiconductor crystal islands for three-dimensional integration
F Crnogorac, S Wong, RFW Pease - Journal of Vacuum Science & …, 2010 - pubs.aip.org
The critical operation needed to achieve monolithic three-dimensional integrated circuits is
obtaining single-crystal, device-quality semiconductor material for upper layer active circuits …
obtaining single-crystal, device-quality semiconductor material for upper layer active circuits …