Recent thermal management techniques for microprocessors
Microprocessor design has recently encountered many constraints such as power, energy,
reliability, and temperature. Among these challenging issues, temperature-related issues …
reliability, and temperature. Among these challenging issues, temperature-related issues …
Outstanding research problems in NoC design: system, microarchitecture, and circuit perspectives
To alleviate the complex communication problems that arise as the number of on-chip
components increases, network-on-chip (NoC) architectures have been recently proposed …
components increases, network-on-chip (NoC) architectures have been recently proposed …
Key research problems in NoC design: a holistic perspective
Networks-on-Chip (NoCs) have been recently proposed as a promising solution to complex
on-chip communication problems. The lack of an unified representation of applications and …
on-chip communication problems. The lack of an unified representation of applications and …
A survey of chip-level thermal simulators
Thermal modeling and simulation have become imperative in recent years owing to the
increased power density of high performance microprocessors. Temperature is a first-order …
increased power density of high performance microprocessors. Temperature is a first-order …
Achieving predictable performance through better memory controller placement in many-core CMPs
In the near term, Moore's law will continue to provide an increasing number of transistors
and therefore an increasing number of on-chip cores. Limited pin bandwidth prevents the …
and therefore an increasing number of on-chip cores. Limited pin bandwidth prevents the …
Thermal-aware floorplanning using genetic algorithms
WL Hung, Y ** and placement for 3-D NoC designs
C Addo-Quaye - Proceedings 2005 IEEE International SOC …, 2005 - ieeexplore.ieee.org
Networks on chip (NoC) and 3D integrated circuits have been proposed as solutions to the
ever-growing interconnect woes surrounding systems-on-chip. 3D designs however suffer …
ever-growing interconnect woes surrounding systems-on-chip. 3D designs however suffer …
Temperature-aware task allocation and scheduling for embedded multiprocessor systems-on-chip (MPSoC) design
Y **e, WL Hung - Journal of VLSI signal processing systems for signal …, 2006 - Springer
Temperature affects not only the performance but also the power, reliability, and cost of the
embedded system. This paper proposes a temperature-aware task allocation and …
embedded system. This paper proposes a temperature-aware task allocation and …
[PDF][PDF] Temperature aware floorplanning
Y Han, I Koren, CA Moritz - Workshop on Temperature Aware …, 2005 - researchgate.net
Power density of microprocessors is increasing with every new process generation resulting
in increasingly higher maximum chip temperatures. The high temperature of the chip greatly …
in increasingly higher maximum chip temperatures. The high temperature of the chip greatly …