Topological nanophononic interface states using high-order bandgaps in the one-dimensional Su-Schrieffer-Heeger model
Topological interface states in periodic lattices have emerged as valuable assets in the
fields of electronics, photonics, and phononics, owing to their inherent robustness against …
fields of electronics, photonics, and phononics, owing to their inherent robustness against …
Design, Manufacture and Assembly of 3D Integrated Optical Transceiver Module Based on an Active Photonic Interposer
The new generation of data centers is further evolving towards the direction of high speed
and intelligence, which puts forward a great demand for the iteration of optical …
and intelligence, which puts forward a great demand for the iteration of optical …
Exploring the benefits of using co-packaged optics in data center and AI supercomputer networks: a simulation-based analysis
P Maniotis, DM Kuchta - Journal of Optical Communications …, 2024 - ieeexplore.ieee.org
We investigate the advantages of using co-packaged optics in next-generation data center
and AI supercomputer networks. The increased escape bandwidth offered by co-packaged …
and AI supercomputer networks. The increased escape bandwidth offered by co-packaged …
Low‐Defect Quantum Dot Lasers Directly Grown on Silicon Exhibiting Low Threshold Current and High Output Power at Elevated Temperatures
The direct growth of III‐V materials on silicon is a key enabler for develo** monolithically
integrated lasers, offering substantial potential for ultradense photonic integration in vital …
integrated lasers, offering substantial potential for ultradense photonic integration in vital …
Compact lithium niobate plasmonic modulator
M Kim, EK Kang, SY Jung, WB Kwon, S Kwon, J Lee - Optics Letters, 2024 - opg.optica.org
Lithium niobate (LN)-based modulators offer superior modulation performances, including
high-speed modulation, linearity, and temperature stability. However, these devices exhibit …
high-speed modulation, linearity, and temperature stability. However, these devices exhibit …
A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical InterposerTM
S Venkatesan, J Lee, SCK Goh, B Pile… - … IEEE Symposium on …, 2022 - ieeexplore.ieee.org
In this paper, we present a unique hybrid integration platform for wafer scale passive
assembly of electronics and photonics devices using a CMOS based Optical Interposer. Our …
assembly of electronics and photonics devices using a CMOS based Optical Interposer. Our …
Detachable interface toward a low-loss reflow-compatible fiber coupling for co-packaged optics (CPO)
High-density reflow-compatible fiber I/O is one of the challenges for co-packaged optics
(CPO). This paper developed a detachable coupling interface based on expanded beam …
(CPO). This paper developed a detachable coupling interface based on expanded beam …
Effects of surface roughness and top layer thickness on the performance of Fabry-Perot cavities and responsive open resonators based on distributed Bragg reflectors
Optical and acoustic resonators based on distributed Bragg reflectors (DBRs) hold
significant potential across various domains, from lasers to quantum technologies. In ideal …
significant potential across various domains, from lasers to quantum technologies. In ideal …
A hybrid interface design based on chip edge connection and inductively coupling connection for 3D stacked chips
Z Yang, Y Cui, J **ong, P Zheng, H Gao… - IEICE Electronics …, 2024 - jstage.jst.go.jp
Conventional three-dimensional packaging chips are based the through-silicon via (TSV)
technology. Compared with TSV, inductively coupled interconnect (ICI) ensures reduced …
technology. Compared with TSV, inductively coupled interconnect (ICI) ensures reduced …