With the increased level of integration and miniaturization of modern electronics, high-power
density electronics require efficient heat dissipation per unit area. To improve the heat …

Polymer nanocomposites combine the merits of polymer matrices and the unusual effects of
nanoscale reinforcements and have been recognized as important members of the material …

Polymer-based electronic packaging materials (such as epoxy resin, polydimethylsiloxane,
and polyvinyl alcohol) are widely used in chips because they have the merits of light weight …

The rise of miniaturized, integrated, and functional electronic devices has intensified the
need for heat dissipation. To address this challenge, it is necessary to develop novel …

Heat dissipation problem is the primary factor restricting the service life of an electronic
component. The thermal conductivity of materials has become a bottleneck that hinders the …

High loading of thermally conductive fillers for enhancing thermal conductivity (TC) conflicts
with proper rheological viscosity in excellent thermal interface materials (TIMs), which …

Polymer-based thermal interface materials (TIMs) are indispensable for reducing the thermal
contact resistance of high-power electronic devices. Owing to the low thermal conductivity of …

To accurately predict the Effective Thermal Conductivities (ETCs) of Three-Dimensional (3D)
braided composites, this work proposes a multi-scale and multi-step Mean-Field …

Different types of heating systems have been developed lately, representing a growing
interest in both the academic and industrial sectors. Based on the Joule effect, fibrous …

The long‐term and stable operation of integrated circuits and microelectronics requires
packaging epoxy resin (EP) exhibit high thermal conductivity for efficient heat dissipation …