The state of the art of lead-free solder joint reliability is investigated in this study. Emphasis is
placed on the design for reliability (DFR) and reliability testing and data analysis. For …

As temperature cycling drives fatigue failure of solder joints in electronic modules,
characterisation of the thermal fatigue response of different solder alloy formulations in BGA …

This paper uses a multi-scale crystal plasticity modelling approach to investigate the role of
microstructure in the damage of Sn-3Ag-0.5 Cu (wt%, SAC305) solder joints subject to …

Purpose This paper aims to review recent reports on mechanical properties of Sn-Bi and Sn-
Bi-X solders (where X is an additional alloying element), in terms of the tensile properties …

Sn–Ag–Cu (SAC) solder alloys are frequently used in electronic assemblies, and their
fatigue resistance under various stress cycles is a significant factor that influences the …

Based on crystal plastic theory, a novel thermomechanical constitutive model was proposed
for Sn‐rich solder. Material parameters of the proposed constitutive model were determined …

Reliability of solder joint is one of the most concerns in the electronic packages. The trend of
smart electronic devices decreases in size and thickness and demands more and more …

The damage of the package structure, caused by the multi-stress coupling of various
environmental factors, can lead to the failure of the electronic device. Therefore, through the …

In 3D packaging memory devices, solder joints are critical links between the chip and the
printed circuit board (PCB). Under severe working conditions, cracks inevitably occur due to …

While the fatigue behaviours (including fatigue life predictions) of lead-free solder joints
have been extensively researched in the last 15 years, these are not adequately compared …