Power module packaging technologies have been experiencing extensive changes as the
novel silicon carbide (SiC) power devices with superior performance become commercially …

Power modules are core components of inverters in electric vehicles and their packaging
technology has a critical impact on system performance and reliability. Conventional single …

In this paper, a high-temperature, high-frequency, wire-bond-based multichip phase-leg
module was designed, fabricated, and fully tested. Using paralleled Silicon Carbide (SiC) …

The significant advance of power electronics in today's market is calling for high-
performance power conversion systems and MEMS devices that can operate reliably in …

Due to their superior material properties, wide bandgap (WBG) semiconductors enable the
application of power electronics at higher temperature operation, higher frequencies, and …

This paper presents the concept, fabrication, and evaluation for quality and reliability of
nickel-tin transient liquid phase (Ni-Sn TLP) bonding that provides high reliability for high …

This paper presents a board-level integrated silicon carbide (SiC) mosfet power module for
high temperature and high power density application. Specifically, a silicon-on-insulator …

In this paper, a fully integrated silicon carbide (SiC)-based six-pack power module is
designed and developed. With 1200-V, 100-A module rating, each switching element is …

High-temperature (HT) converters have gained importance in industrial applications where
the converters operate in a harsh environment, such as in hybrid electrical vehicles, aviation …

State-of-the-art silicon carbide switches have current ratings that are not sufficiently high to
be used in high-power converters. It is, therefore, necessary to connect several switches in …