Turnitin
降AI改写
早检测系统
早降重系统
Turnitin-UK版
万方检测-期刊版
维普编辑部版
Grammarly检测
Paperpass检测
checkpass检测
PaperYY检测
Embedded Microfluidic Cooling with Energetic Electrolytes for the GaN Device: A Feasibility and Adaptability Investigation
As gallium nitride (GaN) high electron mobility transistors advance toward compactness,
effective thermal management is critical to maintaining their operational reliability. A …
effective thermal management is critical to maintaining their operational reliability. A …
Thermal and manufacturing design considerations for silicon-based embedded microchannel-3D manifold coolers (EMMCs): part 1—experimental study of single …
High performance and economically viable cooling solutions must be developed to reduce
weight and volume, allowing for a wide-spread utilization of hybrid electric vehicles. The …
weight and volume, allowing for a wide-spread utilization of hybrid electric vehicles. The …
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers
Silicon-based embedded microchannel with three-dimensional (3D) manifold (MF) μ-cooler
offers lower pressure drop and increased heat removal capability (> 1 kW/cm2) for …
offers lower pressure drop and increased heat removal capability (> 1 kW/cm2) for …
[HTML][HTML] Thermal Interaction and Cooling of Electronic Device with Chiplet 2.5 D Integration
With the development of artificial intelligence (AI) and high-performance computing (HPC),
the microelectronic industry is challenged with increased device integration density. Chiplet …
the microelectronic industry is challenged with increased device integration density. Chiplet …
Embedded manifold microchannel cooling for chiplet thermal management
G Lu, Y Ye, J Wang, B Jiao, Y Kong… - 2024 23rd IEEE …, 2024 - ieeexplore.ieee.org
The chiplet architecture enhances chip performance, but it also leads to heat accumulation,
necessitating efficient cooling techniques. Recent studies have demonstrated embedded …
necessitating efficient cooling techniques. Recent studies have demonstrated embedded …
[KNJIGA][B] Investigating Thermo-Fluidic Performance of Si-Based Embedded Microchannels-3D Manifold Cooling System for High Power Density Electronic …
KW Jung - 2020 - search.proquest.com
High performance and economically viable cooling solutions must be developed to reduce
weight and volume, allowing for a wide-spread utilization of hybrid electric vehicles …
weight and volume, allowing for a wide-spread utilization of hybrid electric vehicles …
Toward Direct Cooling In High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
A strategy for providing semi-direct cooling of SiC MOSFETs in an extremely power dense
half-bridge module, while also serving as a source terminal interconnection is presented …
half-bridge module, while also serving as a source terminal interconnection is presented …
Embedded Cooling of High-Power RF Amplifiers
J Ditri - Embedded Cooling of Electronic Devices: Conduction …, 2024 - World Scientific
High-power radio-frequency (RF) amplifiers (HPAs) are widespread throughout commercial
and military systems, from personal cell phones to large-scale communications networks, to …
and military systems, from personal cell phones to large-scale communications networks, to …