Tensile and compressive stresses in Cu/W multilayers: Correlation with microstructure, thermal stability, and thermal conductivity

G Lorenzin, MSB Hoque, D Ariosa, LPH Jeurgens… - Acta Materialia, 2022 - Elsevier
The internal stress and microstructure in nanomultilayers strongly affect their reliability and
performance, especially towards higher service temperatures. The initial stress and …

Modeling the development and relaxation of stresses in films

MD Thouless - Annual Review of Materials Science, 1995 - research.ibm.com
The mechanics for the development and relaxation of stresses in films is briefly reviewed.
The discussion initially focuses on how stresses are distributed within a film and substrate …

The thermodynamics and kinetics of film agglomeration

DJ Srolovitz, MG Goldiner - Jom, 1995 - Springer
Agglomeration is a common problem in all technological areas that depend on the integrity
and continuity of films. The origin of agglomeration of thin films has been traced to its …

[HTML][HTML] Crack-like grain-boundary diffusion wedges in thin metal films

H Gao, L Zhang, WD Nix, CV Thompson, E Arzt - Acta materialia, 1999 - Elsevier
Constrained grain-boundary diffusion in polycrystalline thin metal films on substrates is
studied as a strongly coupled elasticity and grain-boundary diffusion problem in which no …

Grain boundary grooving in thin films revisited: the role of interface diffusion

D Amram, L Klinger, N Gazit, H Gluska, E Rabkin - Acta materialia, 2014 - Elsevier
Thin nickel (Ni) films were grown on c-plane-oriented sapphire substrates by electron-beam
deposition. The as-deposited films exhibited a mazed bicrystal microstructure consisting of …

Thermal stability of immiscible Cu-Ag/Fe triphase multilayers with triple junctions

T Niu, Y Zhang, J Cho, J Li, H Wang, X Zhang - Acta Materialia, 2021 - Elsevier
Nanostructured metallic multilayers have attracted significant attention due to their high
mechanical strength. However, they often have limited thermal stability at elevated …

The sintering of two particles by surface and grain boundary diffusion—a two-dimensional numerical study

W Zhang, JH Schneibel - Acta metallurgica et materialia, 1995 - Elsevier
We investigate the sintering of two touching circular particles by surface and grain boundary
diffusion. Typical examples for the evolution of the shape of the particles, their surface …

Investigating the mechanism of zinc-induced liquid metal embrittlement crack initiation in austenitic microstructure

A Ghatei-Kalashami, MS Khan, F Goodwin… - Journal of Materials …, 2023 - Springer
Catastrophic brittle failure of ductile materials by liquid metal embrittlement (LME) is a widely
documented phenomenon but the fundamentals of its initiation mechanism are poorly …

Oxygen diffusion and crack growth for a nickel-based superalloy under fatigue-oxidation conditions

A Karabela, LG Zhao, B Lin, J Tong… - Materials Science and …, 2013 - Elsevier
Advanced microscopy characterisation and numerical modelling have been carried out to
investigate oxygen diffusion and crack growth in a nickel-based superalloy under fatigue …

Mass transport at interfaces in single component systems

WW Mullins - Metallurgical and Materials Transactions A, 1995 - Springer
Mass transport at interfaces is induced by a gradient of chemical potential along the
interface; typically, at surfaces, this is caused by a gradient in curvature and, at grain …