Microprocessor aging analysis and reliability modeling due to back-end wearout mechanisms

CC Chen, L Milor - IEEE Transactions on Very Large Scale …, 2014 - ieeexplore.ieee.org
Back-end wearout mechanisms are major reliability concerns for modern microprocessors.
In this paper, a framework that contains modules for back-end time-dependent dielectric …

System-level modeling of microprocessor reliability degradation due to bias temperature instability and hot carrier injection

CC Chen, T Liu, L Milor - … on Very Large Scale Integration (VLSI …, 2016 - ieeexplore.ieee.org
Negative bias temperature instability (NBTI), positive bias temperature instability (PBTI), and
hot carrier injection (HCI) are leading reliability concerns for modern microprocessors. In this …

Comprehensive reliability and aging analysis on SRAMs within microprocessor systems

T Liu, CC Chen, W Kim, L Milor - Microelectronics Reliability, 2015 - Elsevier
A framework is proposed to analyze the impact of both Front End of the Line (FEOL) and
Back End of the Line (BEOL) wearout mechanisms on memories embedded within state-of …

Memory and logic lifetime simulation systems and methods

L Milor, T Liu, CC Chen - US Patent 10,514,973, 2019 - Google Patents
Aspects of the disclosed technology include a method including extracting, by a processor, a
plurality of features from one from among a layout of a circuit, a netlist of the circuit, and the …

Processor-level reliability simulator for time-dependent gate dielectric breakdown

CC Chen, T Liu, S Cha, L Milor - Microprocessors and Microsystems, 2015 - Elsevier
Time-dependent gate dielectric breakdown (TDDB) is a leading reliability concern for
modern microprocessors. In this paper, a framework is proposed to analyze the impact of …

Analysis of time-dependent dielectric breakdown induced aging of SRAM cache with different configurations

R Zhang, T Liu, K Yang, L Milor - Microelectronics Reliability, 2017 - Elsevier
Time dependent dielectric breakdown degrades the reliability of SRAM cache. A novel
methodology to estimate SRAM cache reliability and performance is presented. The …

Estimation of the optimal accelerated test region for FinFET SRAMs degraded by front-end and back-end wearout mechanisms

R Zhang, K Yang, T Liu, L Milor - 2018 Conference on Design …, 2018 - ieeexplore.ieee.org
Advanced FinFET SRAMs undergo reliability degradation due to various front-end and back-
end wearout mechanisms. The design of reliable SRAMs benefits from accurate wearout …

System-level modeling of microprocessor reliability degradation due to TDDB

CC Chen, S Cha, L Milor - Design of Circuits and Integrated …, 2014 - ieeexplore.ieee.org
Time-dependent dielectric breakdown (TDDB) is leading reliability concerns for modern
microprocessors. In this paper, a framework is proposed to analyze the impact of TDDB on …