This review compares the mechanical and thermal-electrical properties of sintered copper
(Cu) with sintered silver (Ag) as bonding materials in the microelectronics joint applications …

A review is provided, which first considers low-temperature diffusion bonding with silver
nanomaterials as filler materials via thermal sintering for microelectronic applications, and …

Nanoindentation technology is an effective and convenient method for evaluating the
mechanical properties of materials at micro and nano scales. Since the complete …

SiC microparticles with various weight ratios (0.0, 0.5, 1.0 and 1.5 wt%) are incorporated into
sintered silver nanoparticles (AgNP) as one of the promising packaging materials for high …

The present study is focused on the development of low Ag content 99Sn-0.3 Ag-0.7 Cu
(SAC0307) solder alloy with Al 2 O 3 nanoparticles reinforcement. The effects of multiple …

Nanoindentation experiments were performed at room temperature on pressure-less
sintered silver nanoparticles (AgNP) samples. Two representative die attach solder …

Sintered silver is a promising die-attach material capable of operating at temperatures of
more than 200° C. However, while sintering reliably bonds Ag paste on Ag-plated substrate …

Nano-silver paste is considered one of the most promising die-attach materials for high-
temperature applications contributing to its excellent thermal and electrical properties and …

Finite element (FE) simulation is adopted as a fundamental tool to evaluate the mechanical
reliability of packaging structures for electronic devices. Nevertheless, the determination of …

The tensile strength of nanoporous silver (AgNPs) is investigated by experiments and
molecular dynamic analysis. Effects of sintering temperature on the porosity and ultimate …