In the big data era, Si chips are integrated more and more to satisfy the fast growing demand
from customers. In addition, in the post-COVID-19 virus era, the trend of distance teaching …

Electronic products are evolving towards miniaturization, high integration, and multi-function,
which undoubtedly puts forward higher requirements for the reliability of solder joints in …

Micro/nano electromechanical systems and nanodevices often suffer from degradation
under electrical pulse. However, the origin of pulse-induced degradation remains an open …

Cross phenomena, representing responses of a system to external stimuli, are ubiquitous
from quantum to macro scales. The Onsager theorem is often used to describe them, stating …

The development of hybrid solder for chip packing is a major 3D packaging research topic.
The incorporation of with low melting points into solder materials has been used in low …

Mechanical performance is one of the most important factors influencing the reliability of
solder joints. Heretofore, plenty of works have been conducted on reliability of solder joints …

Today's thermodynamics is largely based on the combined law for equilibrium systems and
statistical mechanics derived by Gibbs in 1873 and 1901, respectively, while irreversible …

Achieving control over magnon spin currents in insulating magnets, where dissipation due to
Joule heating is highly suppressed, is an active area of research that could lead to energy …

Due to the demand for high-performance electronic products, there has been a rapid
development in three-dimensional integrated circuit (3D IC) packaging technology. The 3D …

Two‐dimensional layered transition metal dichalcogenides (TMDCs) are promising
memristive materials for neuromorphic computing systems. Despite extensive experimental …