Critical heat flux (CHF), heat transfer surface temperature, and thermal resistance are
arguably the three most important design and performance parameters for any two-phase …

With the development of modern microelectronics technology, electronic chips are
constantly evolving towards high performance, miniaturization and integration, which …

Maintaining proper operation temperature is a basial need for electronic devices. However,
the current thermal management strategy for electronic devices generally provides a fixed …

Given the lightweight nature and excellent thermal conductivity of aluminum, it offers
significant potential for light-weighting of phase-change cooling components. To further …

Miniaturisation of semiconductor devices surges thermal management challenges, making
effective heat dissipation crucial for durability and optimal performance. This study …

Additive Manufacturing (AM) has emerged as a high-potential manufacturing technology for
fabricating all-in-one heat exchange devices that incorporate embedded two-phase heat …

With the increase in the integration level of chips, capillary heat pipes are becoming
increasingly valuable for the thermal management of high-heat-flux electronic devices. Here …

The integration of heat pipes as a passive thermal management system for nuclear reactors
has been proposed as it provides the advantages of compact design, reliability, efficient heat …

The demand for lightweight heat dissipation devices in aerospace and various other fields
has spurred the development of aluminum-based vapor chambers. However, the surface of …

Aluminum flat plate heat pipes have attracted much attention in mobile devices and high-
performance computing due to their lightweight and cost-effectiveness. However, traditional …