In contact dispensing process including the extruding, stretching, and liquid-bridge breakup,
the initial distance dn− sini between the needle tip and the substrate has great influence on …

Direct extrusion of high viscosity pastes containing micron-sized particles at the microscale
is a major challenge in the field of additive manufacturing. The nozzle, as a crucial …

This paper addresses a new methodology to fabricate cellular structures with embedded
close pores distributed in controlled fashion. A hybrid additive manufacturing system …

Within this thesis, the dispensing technology was enhanced to a high throughput alternative
for industrial front side metallization in silicon (Si) Photovoltaic (PV) production lines. Starting …

Introduction: The contact dispensing process is composed of extrusion, stretching, and liquid
bridge breakage, which is greatly impacted by the viscosity and surface tension of the …

Due to increasing environmental consciousness, the European Union has prohibited the
use of lead substances in electronics soldering material. 58Bi/42Sn solder with a melting …

Jet dispensing has been widely considered as the next generation of dispensing
technology. Since there is no online measurement of the droplet volume in the jetting …

Surface mount adhesives are used to hold electronic components on printed circuit boards
or substrates. When dispensed onto a surface, the adhesive dots have to meet distinctive …

The features of droplets formed in contact micro-liquid dispensing have a great influence on
the dispensing process that it is important to research the droplets' formation. Based on …

An automated approach is proposed for a microassembly task, which is to insert a 10 µm
diameter glass tube into a 12 µm diameter hole in a silicon substrate, and bond them …