Interconnect scaling has become a major design challenge for traditional planar (2D)
integrated circuits (ICs). Three-dimensional (3D) IC that stacks multiple device layers …

Effective management of ICT (information and communications technology) and cooling is
critical in modern data centres for high energy efficiency. This survey paper gives an …

Driven by the demands of the intelligent industry, integrated circuit chip has witnessed
development in the direction of use of increased number of transistors and larger area …

Process technology-driven performance and energy efficiency improvements have slowed
down as we approach physical design limits. General-purpose manycore architectures …

The process of flow boiling within micro-passages plays a very important role in many
industrial applications. However, there is still a lack of understanding of the effect of an …

A novel microchannel heat sink with an excellent die-level hotspot mitigation capability has
been introduced for electronic cooling applications. The basic concept of the proposed …

Several key attributes of a 3D integrated chip structure are analyzed in this work. Critical
features related to the effect of the size of the substrate, heat sink, device layer, through …

Embedded systems must address a multitude of potentially conflicting design constraints
such as resiliency, energy, heat, cost, performance, security, etc., all in the face of highly …

As result of technology scaling, single-chip multicore power density increases and its spatial
and temporal workload variation leads to temperature hot-spots, which may cause …

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