The shrinking of transistors has hit a wall of material degradation and the specialized
electronic applications for complex scenarios have raised challenges in heterostructures …

Continued reduction in transistor size can improve the performance of silicon integrated
circuits (ICs). However, as Moore's law approaches physical limits, high‐performance …

In the field of semiconductors, three-dimensional (3D) integration not only enables
packaging of more devices per unit area, referred to as 'More Moore'but also introduces …

Data-driven algorithms—such as signal processing and artificial neural networks—are
required to process and extract meaningful information from the massive amounts of data …

Image sensors with internal computing capability enable in-sensor computing that can
significantly reduce the communication latency and power consumption for machine vision …

The development of high-performance memory devices has played a key role in the
innovation of modern electronics. Non-volatile memory devices have manifested high …

It is predicted that the conventional von Neumann computing architecture cannot meet the
demands of future data‐intensive computing applications due to the bottleneck between the …

Flexible, stretchable, and bendable materials, including inorganic semiconductors, organic
polymers, graphene, and transition metal dichalcogenides (TMDs), are attracting great …

Abstract Two-dimensional (2D) transition metal chalcogenides (TMC) and their
heterostructures are appealing as building blocks in a wide range of electronic and …

The demand for economical and efficient data processing has led to a surge of interest in
neuromorphic computing based on emerging two‐dimensional (2D) materials in recent …