Remaining useful lifetime prediction and extension of Si power devices have been studied
extensively. Silicon carbide (SiC) power devices have been developed and commercialized …

Electronic products are evolving towards miniaturization, high integration, and multi-function,
which undoubtedly puts forward higher requirements for the reliability of solder joints in …

Abstract This study employs Finite Element Analysis (FEA) to investigate the effects of creep,
fatigue, and random vibration on the integrity of solder joints in BGA packages in electronic …

Accelerated degradation of solder joint interconnections in crystalline silicon photovoltaic (c-
Si PV) modules drives the high failure rate of the system operating in elevated temperatures …

The state of the art of lead-free solder joint reliability is investigated in this study. Emphasis is
placed on the design for reliability (DFR) and reliability testing and data analysis. For …

Spraying of agrochemicals (pesticides, fertilizers) causes environmental pollution on a
million‐ton scale. A sustainable alternative is target‐specific, on‐demand drug delivery by …

The new packaging technologies used for gallium nitride (GaN) devices avoid wire bonds
and leads in order to completely utilize their switching performance. This also means that …

We target the problem of managing the power states of the servers in a Cloud Data Center
(CDC) to jointly minimize the electricity consumption and the maintenance costs derived …

Purpose This study aims to investigate the reliability issues of microvoid cracks in solder
joint packages exposed to thermal cycling fatigue. Design/methodology/approach The …

While the fatigue behaviours (including fatigue life predictions) of lead-free solder joints
have been extensively researched in the last 15 years, these are not adequately compared …