Light-emitting diodes (LEDs) are considered an ideal substitute for low-efficiency traditional
light sources with broad applications in all scientific disciplines. For the past recent years …

Silicon carbide (SiC) devices have shown definite advantages over Si counterparts in high-
temperature, high-voltage, and high-frequency applications. To fully exploit the potentiality of …

Nano-silver paste is an emerging lead-free bonding material in power electronics, and has
excellent mechanical properties, thermal conductivity and long-term reliability. However, it is …

This article introduces an online condition monitoring strategy that utilizes a transient heat
pulse to detect package thermal performance degradation. The metric employed is the …

There is a high demand for the implementation of metallic nanoparticle (NP) sintering
technology for die attach in high-power electronics. The performance of this technology is …

Nano-silver has the characteristics of low-temperature sintering and high-temperature
service, which can reduce the thermal stress in the packaging process. Because of the high …

Resin-reinforced Ag sintering materials represent a promising solution for die-attach
applications in high-power devices requiring enhanced reliability and heat dissipation …

In this paper, we presented several practical aspects for building robust and reliable finite
element models in thermomechanical modeling in electronics packaging using finite …

Reliable operation of high power GaN amplifiers at maximum performance relies on the
mutual optimization of several design parameters constrained by a defined thermal budget …

Wide bandgap (WBG) power devices have been attracting increasing attention for next-
generation electronic applications. Cu–Cu bonding has been developed to accommodate …