The electrochemical corrosion behaviour and corrosion mechanism of Sn-9Zn-xGe alloy in
3.5 wt.% NaCl solution was investigated using electrochemical techniques combined with …

The dendrite problem of zinc anodes leads to poor cyclic life and safety hazards, which
seriously hinders the development of aqueous zinc-ion batteries (ZIBs). Herein, we propose …

Abstract Sn-0.7 Cu–In ternary alloy solders have received much attention because of their
excellent weld stability and wettability. However, how to inhibit or slow down the formation of …

Sn–Bi solder is considered a promising lead-free solder which meets the performance
requirements with the advantages of low melting point, good wettability and mechanical …

Sn–Bi-based solder alloys have triggered substantial concern in development of low-
temperature interconnecting materials of multi-level packaging electronic devices. However …

This research investigated the combined effects of addition of Bi and Sb elements on the
microstructure, thermal properties, ultimate tensile strength, ductility, and hardness of Sn-0.7 …

A new type of low-melting-point heterogeneous alloy (LMH), based on Sn58Bi alloy (SBE),
was prepared using Cu, Zn, Ag, and Sb microalloying and rapid solidification. The addition …

Abstract Zn–30Sn–2Cu–0.5 Ni–0.2 Al (ZnSnCuNiAl) solder joints were isothermally aged in
the temperature range of 100–170° C for up to 360 h, and the growth behavior and kinetics …

A novel-type Zn–30Sn–2Cu–0.5 Ni–0.2 Al multicomponent high-temperature lead-free
solder alloy was prepared, and its thermal behavior, electrochemical properties were …

In this study, we investigated the microstructure, mechanical properties, and thermal
performance of Sn-xBi-1Ag (x= 35, 37, 45, and 47 wt.%) solders, with a particular focus on …