Effects of test conditions on shear strength of surface mount solder joints
E Harkai, B Balogh, I Latos - 33rd International Spring Seminar …, 2010 - ieeexplore.ieee.org
In electronic industry shear test is a commonly used method to classify the mechanical
properties and reliability of solder joints. The aim of this paper is to investigate how the shear …
properties and reliability of solder joints. The aim of this paper is to investigate how the shear …
Determination of strength of interface in packages based on an approach using coupling of experimental and modeling results
D Weidmann, G Dubois, M Hertl… - 2011 12th Intl. Conf. on …, 2011 - ieeexplore.ieee.org
The aim of this paper is to present the work we realized to determinate the strength of
interfaces in a package. The work consisted of coupling experimental and modelling results …
interfaces in a package. The work consisted of coupling experimental and modelling results …
Applying microscopic analytic techniques for failure analysis in electronic assemblies
O Grosshardt, BÁ Nagy, A Laetsch - Applied Microscopy, 2019 - Springer
The present paper gives an overview of surface failures, internal nonconformities and
solders joint failures detected by microscopic analysis of electronic assemblies. Optical …
solders joint failures detected by microscopic analysis of electronic assemblies. Optical …
Metallurgical studies of EDD steel in stretching forming operations at various temperatures
R Goud, R Karhikeyan, SR Alex… - American Institute of …, 2023 - ui.adsabs.harvard.edu
Microstructure, low density, grain size, and density of deep-grained steel grains are studied
in depth. In metal models of deep square and rectangular design, the stretching process is …
in depth. In metal models of deep square and rectangular design, the stretching process is …